ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,603, issued on Sept. 22, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Pick-and-place tool with warpage-... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,604, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "In situ film growth sensor assembly, apparatus, an... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,605, issued on Sept. 22, was assigned to NICHIA Corp. (Anan, Japan). "Method of manufacturing light emitting device" was invented by Hiroa... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,606, issued on Sept. 22, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory device structure and forming method including reti... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,607, issued on Sept. 22, was assigned to AUO Corp. (Hsinchu, Taiwan). "Display panel having sub-pixels with different orienting characteri... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,608, issued on Sept. 22, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Endpoint detection in low open area and/or high as... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,609, issued on Sept. 22, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Paris). "Test vehicle and test me... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,610, issued on Sept. 22, was assigned to APPLIED MATERALS INC.. "Implant hard mask for substrates" was invented by Jun Fang (Xi'an, China)... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,611, issued on Sept. 22, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Substrate processing method and apparatus" was invent... और पढ़ें
ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,612, issued on Sept. 22, was assigned to Tokyo Electron Ltd. (Tokyo). "Methods and structures for improving etch profile of underlying lay... और पढ़ें